Bergquist GapFiller3500S35雙組分液態(tài)間隙填充導熱材料

材料生產(chǎn)商：美國貝格斯（BERGQUIST）公司研發(fā)產(chǎn)品

GapFiller3500S35可供規(guī)格：

規(guī)格(Specifications): 50CC、400CC、1200CC、6gallon

導熱系數(shù)(Thermal Conductivity)：3.6W/m-k

基材(Reinfrcement Carrier)：硅膠

膠面(Glue)：無

顏色(Color)：藍色/白色

包裝(Pack)：美國原裝進口包裝

持續(xù)使用溫度（Continous Use Temp）：-60°~200°

密度（Density）: 3.0g/cc

GapFiller3500S35應用材料特性：

GapFiller3500S35雙組分配方便易于儲存，觸變特性使其容易點膠，超好貼服性，針對易碎和低壓力應用設計，室溫固化及加速固化

Gap Filler 3500S35 is a two-component liquid gap filling material, cured at either room or elevated temperature, featuring ultra-high thermal performance and superior softness. Prior to curing, the material maintains good thixotropic characteristics as well as low viscosity. The result is a gel-like liquid material designed to fill air gaps and voids yet flow when acted upon by an external force (e.g. dispensing or assembly process). The material is an excellent solution for interfacing fragile components with high topography and/or stack-up tolerances to a universal heat sink or housing. once cured, it remains a low modulus elastomer designed to assist in relieving CTE stresses during thermal cycling yet maintain enough modulus to prevent pump-out from the interface. Gap Filler 3500S35 will lightly adhere to surfaces, thus improving surface area contact. Gap Filler 3500S35 is not designed to be a structural adhesive.

GapFiller3500S35材料應用：

汽車電子，獨立元器件到外殼，PCBA到外殼，光纖通訊設備，印刷電路板組件和外殼之間，光纖通訊設備

GapFiller3500S35技術(shù)優(yōu)勢分析：

GapFiller3500S35間隙填充材料提供了卓越的導熱性能并且是使用液態(tài)點膠設備的理想產(chǎn)品，作為在現(xiàn)場成型的彈性體，針對不平整的板子起伏，他們的很好貼服性特性提供了很大的厚度覆蓋。他們理想的應用于易碎的和低應力應用場合，比如電源電子和獨立元器件。他們的低粘性可以確保點膠設備在壓力較低的情況下，提供更快的流量，壓力過高會使膠類分解且影響機械性能。固化后，形成干的可觸摸的表面，沒有固化副產(chǎn)物，可以得到干凈的裝配件。